Hearing device with embedded integrated circuit chips

ABSTRACT

A hearing device includes: a multi-chip assembly including a plurality of integrated circuit chips, the plurality of integrated circuit chips including one or a combination of a wireless communication chip, a power management chip, and a signal processing chip; wherein the multi-chip assembly comprises: a first layer having a surface, a spacer layer being configured to accommodate one or more of the plurality of integrated circuit chips as one or more embedded chips, and a ground layer below the first layer and the spacer layer, and a first shielding layer between the spacer layer and the first layer.

RELATED APPLICATION DATA

This application claims priority to, and the benefit of, European PatentApplication No. 18209634.7 filed on Nov. 30, 2018. The entire disclosureof the above application is expressly incorporated by reference herein.

FIELD

The present disclosure relates to hearing devices, such as hearingdevices for compensating a hearing loss of a user, particularly hearingdevices having wireless communication capabilities and thus hearingdevices comprising antennas for communication.

The present disclosure further relates to a hearing device configured tocommunicate using magnetic induction and/or to communicate through theuse of radio frequencies. The hearing device may be used in a binauralhearing device system. During operation, the hearing device is worn inor at the ear of a user for alleviating a hearing loss of the user.

BACKGROUND

Hearing devices are very small and delicate devices and comprise manyelectronic and metallic components contained in a housing or shell smallenough to fit in the ear canal of a human or be located behind the outerear. The many electronic and metallic components in combination with thesmall size of the hearing device housing or shell impose high designconstraints on antennas to be used in hearing devices with wirelesscommunication capabilities, both MI antennas and RF antennas.

Moreover, particularly the RF antenna in the hearing device must bedesigned to achieve a satisfactory performance despite these limitationsand other narrow design constraints imposed by the size of the hearingdevice.

The developments within wireless technologies for hearing devices andthe continuous efforts to make hearing devices smaller and more costeffective to manufacture has led to the use of flexible carriersincorporating one or more antennas in hearing devices.

Still further, in binaural hearing device systems, the requirements tothe quality of the communication between the hearing devices in thebinaural hearing device system are ever increasing, and include demandsfor low latency and low noise, increasing the requests for effectiveantennas in the hearing devices.

Still further, the hearing devices typically includes an amount of(litze) wires that may degrade performance of antennas positioned insidethe hearing devices.

All these demands proves difficult to solve with existing devices, asthe present communication capabilities are insufficient. SUMMARY

It is an object to provide a hearing device communication capability.The communication capability may be through the use of radio frequency(RF)-antenna functionality, such as Bluetooth, at low cost and lowdevice complexity. The communication capability may be through the useof magnetic induction.

It is also an object to improve the wireless communication capabilities,such as improved wireless communication capabilities between two hearingdevices worn in or behind opposite ears of the user, and/or between ahearing device and an accessory device, such as a smart phone. Thehearing devices may be configured for wireless communication in an ISMfrequency band. The RF antenna functionality may be implemented foroperation at a frequency of at least 400 MHz, such as at a frequency ofbetween 800 MHz and 6 GHz. The hearing devices may additionally oralternatively be configured for wireless communication in a frequencyrange from 2 MHz-30 MHz.

Radio connectivity between hearing devices allows for advanced binauralsignal processing when the important ear-to-ear (E2E) link is ensured.Furthermore, the hearing devices may be connected to a plethora ofaccessories, either body-worn or being placed in the user's proximity,and hence to the Internet as part of the so-called Internet-of-things(IoT). However, it is challenging but of key importance to ensure astable E2E link. The 2.4 GHz ISM (Industrial, Scientific, Medical) bandis preferred due to the presence of many harmonized standards forlow-power communications, such as Bluetooth Low Energy (BLE) or ZigBee,its worldwide availability for industrial use, and the trade-off betweenpower consumption and achievable range. The E2E link is particularlydemanding in terms of requirements on the wearable antenna design andperformance. In fact, to achieve a good on-body performance the antennamay exhibit optimal radiation efficiency, bandwidth, polarization, andradiation pattern, while the physical volume available for the design isextremely reduced, as most times space comes at a premium in wearabledevices such as hearing devices, in particular in-the-ear (ITE) hearingdevices. Furthermore, mass production and industrial design needsprovide a desire that the antenna may also be low-profile, lightweight,and inexpensive to manufacture. The antenna polarization characteristicmay be an important performance parameter. More overall constrains mayalso be relevant. In fact, antenna efficiency may be seriouslyjeopardized by the proximity of the antenna to the human head, as thebody tissues have very high losses around 2.4 GHz due to their highwater content. This may critically impact the overall performance giventhe magnitude of the drop-in efficiency and the fact that the hearingdevice radios operate in an ultra-low-power regime. Another issuethreatening antenna efficiency may be the small volume available for thedesign, as this necessarily brings the antenna in close physical, hence,as well as electromagnetic, proximity of other parts of the device, witha strong likelihood of coupling to them. A large bandwidth is hard toachieve as well for an electrically small antenna (ESA) due to itsfundamental limits. The bandwidth may cover at least the whole 2.4 GHzISM band, but a larger bandwidth may help to compensate for the detuningof the antenna caused by the effects of the body, effects which variesacross users.

Magnetic induction, or near-field magnetic induction (NFMI), typicallyprovides communication, including transmission of voice, audio and data,in a range of frequencies between 2 MHz and 30 MHz. At these frequenciesthe electromagnetic radiation propagates through and around the humanhead and body without significant losses in the tissue. The magneticinduction antenna operating at such frequencies could be susceptible tonoise originating from the hearing device electric components.

In accordance with the present disclosure, the above-mentioned and otherobjects are obtained by the disclosed hearing device. The hearing devicecomprises a multi-chip assembly including a plurality of integratedcircuit chips, the plurality of integrated circuit chips including atleast one of a wireless communication chip, a power management chip, anda signal processing chip. The hearing device may comprise a battery forsupplying power. In some embodiments, the multi-chip assembly comprisesa plurality of layers including a first layer having a surface, and aspacer layer being configured to accommodate at least one of theplurality of integrated circuit chips as an embedded chip. A groundlayer may be provided below the first layer and the spacer layer. Themulti-chip assembly may further comprise at least one shielding layer,including a first shielding layer, the first shielding layer beingprovided between the spacer layer and the first layer. The firstshielding layer may be provided above the spacer layer. The firstshielding layer may provide a shielding of the embedded chip. The groundlayer may provide a shielding of the embedded chip. The first shieldinglayer and the ground layer may in combination provide a shielding of theembedded chip.

In some embodiments, the shielding layer reduces unwantedelectromagnetic radiation from the embedded chip, and thus reducesunwanted electromagnetic radiation from the multi-chip assembly. In someembodiments, the unwanted electromagnetic radiation includes noise, insome embodiments, the unwanted electromagnetic radiation includes noisefrom ripple effects of power management units.

In some embodiments, the hearing device comprises an MI antennafacilitating communication via magnetic induction. In some embodiments,the hearing device comprises an RF antenna facilitating communicationvia radio frequencies. In some embodiments, the hearing device comprisesan MI antenna facilitating communication via magnetic induction and anRF antenna facilitating communication via radio frequencies. In someembodiments, the MI antenna and/or the RF antenna are provided withinthe hearing device. In some embodiments, a part of the antenna, MIand/or RF, may protrude outside of a hearing device housing, such asoutside of a hearing device shell.

Some hearing devices comprises a number of wires, such as litze wires,interconnection electrical hearing device components. Such wires mayinfluence performance for antennas provided inside the hearing device,such as for antennas provided at least partly inside the hearing device.Such influence may degrade performance for both an RF antenna and an MIantenna provided inside the hearing device. In some embodiments, thewires may be randomly positioned from product to product renderingcontrol of the influence on and potential degradation of antennaperformance challenging. It is therefore an advantage of the presentdisclosure that the number of wires may be reduced. By reducing thenumber of wires it will be possible to improve the performance of the RFantenna and/or the MI antenna as provided in the hearing device.Particularly for MI antennas, the Signal-to-noise ration may be reducedby reducing the number of or removing wires, which may radiate noise inthe same frequency in which the MI antenna is operating. Particular forRF antennas, antenna performance may be improved by reducing the numberof wires or removing wires as there will be no or fewer wires to act asground plane extension for the RF antenna. Thus, common mode radiationmay be reduced.

In some embodiments, the spacer layer is provided between a second layerand a third layer of the plurality of layers.

The ground layer may be electrically insulated from at least the firstlayer by means of an insulating layer. A connection to the ground layermay be provided via through-holes in the first layer, the spacer layerand the insulating layer, and additionally through any second and thirdlayers.

In some embodiments, the second layer is the shielding layer. In someembodiments, the third layer is the insulating layer. Thus, the spacerlayer may be provided between second layer and the third layer, such asbetween the shielding layer and the insulating layer.

In some embodiments, the hearing device comprises one or moremicrophones configured to receive an audio signal. The audio signal isprovided to a signal processor configured to process the audio signalfor compensating a hearing loss of a user. The signal processor maycomprise elements such as amplifiers, compressors and noise reductionsystems, etc. for processing the audio signal to compensate a hearingloss of a user. The signal processing chip may comprise the signalprocessor.

In some embodiments, the at least one embedded chip includes acontrolling chip, such as an integrated circuit chip configured tocontrol the operation and/or the power supply to another component, suchanother component not provided in the multi-chip assembly.

In some embodiments, the chip is an electronic component. In someembodiments, the embedded chip is an embedded electronic component. Insome embodiments, the embedded chip is an active device or an activeelectronic component.

In some embodiments the embedded chip is a shielded embedded chip, suchas an electromagnetically shielded embedded chip. The shielding providedby the plurality of shielding layers, including the first shieldinglayer.

In some embodiments, the first shielding layer provides a shielding ofthe embedded electronic component. The ground layer may provide ashielding of the embedded electronic component. The first shieldinglayer and the ground layer may in combination provide a shielding of theembedded electronic component.

In some embodiments, the at least one embedded chip includes thewireless communication chip. In some embodiments the at least oneembedded chip includes the power management chip.

The plurality of layers including the first layer having a surface, thesecond layer, the third layer, the spacer layer, the insulating layerand the ground layer, may be provided as a multilayer printed circuitboard, a multilayer flexible printed circuit board, etc. In someembodiments, the multi-chip assembly comprises a printed circuit board,PCB, or a flexible printed circuit board, FPCB. In some embodiments, thelayers are single-sided layer, in some embodiments the layers are doublesided layer. In some embodiments, the multi-chip assembly printedcircuit board, comprises both single-sided layers and double-sidedlayers.

In some embodiments, the first layer having a surface and the secondlayer are the same layer. In some embodiments, the first layer has aconductive surface. In some embodiments the surface of the first layeris configured for mounting electronic components thereon. The surface ofthe first layer may be configured for surface mount technology, SMT.

In some embodiments, the spacer layer provides an opening configured toaccommodate the at least one of the plurality of integrated circuitchips. The spacer layer may comprise one or more spacer elements, suchas spacer elements being configured to provide a stand-off distancebetween the third layer and the second layer. In some embodiments theopening is provided in between the spacer elements. The spacer layer maybe a mechanical spacer layer. The thickness of the spacer layer maycorrespond to the thickness of the components, chips, to be embedded.

In some embodiments, the embedded chip is mounted onto the third layer.It is envisaged that the embedded chip may be mounted onto the thirdlayer in any known way, including bonding, soldering, gluing, surfacemount technology, etc. The embedded chip may be a bare die, the embeddedchip may be mounted using flip chip bonding, wire bonding, etc. Theembedded chip may be a packaged chip, such as a pre-packaged chip andmay be mounted onto the third layer using any known technique, such asusing pins, leads, ball grid arrays, etc.

In some embodiments, the plurality of shielding layers are providedabove and/or below the embedded chip, the plurality of shielding layers,including the first shielding layer, reduces electromagnetic emissionfrom the at least one embedded chip. The shielding layer may be anelectromagnetic shielding layer. The shielding layer may be configuredto shield electromagnetic radiation from the at least one embedded chip.The shielding layer may be configured to contain electromagneticradiation from the at least one embedded chip. In some embodiment, theelectromagnetic radiation from the at least one embedded chip is reducedor limited by the shielding layer so that the electromagnetic radiationdoes not propagate to the surface of the first layer.

In some embodiments, the shielding layer is an electrically insulatinglayer. In some embodiments, the shielding layer is a layer of anelectric conductive material, such as copper. The shielding layer may bean electromagnetic shielding layer. In some embodiments, the shieldinglayer may comprise a coated layer, such as a layer coated by aconductive coating, such as copper, such as conductive ink, theshielding layer may be a metallic layer, such as a sheet metal layer,etc.

In some embodiments, a shielding layer may be configured as a groundlayer, such as a ground layer forming a ground plane for the multi-chipassembly.

In some embodiments, the multi-chip assembly comprises a first embeddedchip and a second embedded chip, and wherein a shielding is providedbetween the first embedded chip and the second embedded chip. In someembodiments, the first embedded chip and the second embedded chip areaccommodated by the same spacer layer. In some embodiments, the firstembedded chip and the second embedded chip are accommodated by differentspacer layers. In some embodiments, the multi-chip assembly comprises afirst spacer layer for accommodating the first embedded chip and asecond spacer layer for accommodating the second embedded chip. Ashielding layer may be provided between the first spacer layer and thesecond spacer layer.

In some embodiments, the multi-chip assembly includes a plurality of oneor more integrated circuit chips, the plurality of integrated circuitchips including at least one of a wireless communication chip, a powermanagement chip , and a signal processing chip. The multi-chip assemblymay be provided at a carrier board. The multi-chip assembly may betermed a hybrid. The multi-chip assembly may comprise a multi-layeredstructure for accommodating at least some of the hearing deviceelectronic components. The multi-chip assembly may comprise amulti-layered printed circuit board.

The multi-chip assembly may be any assembly of integrated circuits,semiconductor dies and/or other discrete electronic components. Themulti-chip assembly comprises two or more electronic componentsintegrated in the assembly. The electronic components may be provided as“bare dies”; however it is envisaged that some, or all, electroniccomponents of the multi-chip assembly may be pre-packaged while other,or none, of the electronic components of the multi-chip assembly may bemounted as bare dies or chips or vice versa. The multi-chip assembly mayreferred to as a hybrid multi-chip assembly as a number of electroniccomponents are inter-connected. The multi-chip assembly may comprise amulti-layered structure for accommodating at least some of the hearingdevice electric components. The multi-chip assembly may comprise amulti-layered printed circuit board. The electronic components areintegrated and mounted onto a substrate so that the multi-chip assemblymay be handled as a single assembly comprising multiple electroniccomponents. In some embodiments, the multi-chip assembly is provided asa single component for mounting in a hearing device.

In some embodiments, the first embedded chip is the power managementchip and the second embedded chip is the wireless communication chip.

In some embodiments, the hearing device comprises a magnetic inductionantenna and/or an RF antenna.

In some embodiments, the power management chip comprises regulators forregulating the power. However, such regulators typically contribute withswitching noise, or ripple, which is above the noise floor for amagnetic induction antenna. The regulator switching may result involtage fluctuation on the output voltage. The regulator switching mayresult in current fluctuation on the output current. Such voltage andcurrent fluctuations, ripple effects, contribute to the overall noise inthe hearing device. A magnetic induction antenna typically has a noisefloor of below 50 μV at any pads of the magnetic induction antenna, suchas a noise floor below 20 μV, such as a noise floor of 17 μV, such as anoise floor of about 17 μV, thus, the magnetic induction antenna issensitive to noise in the hearing device, such as noise stemming fromelectronic components of the hearing device.

It is an advantage of embedding one or more chips in multi-chipassembly, in that noise from the multi-chip assembly may be reduced. Itis an advantage of reducing noise from the multi-chip assembly withouthaving to provide a so-called shielding can around the multi-chipassembly.

It is an advantage of one or more embodiments of the present disclosurethat a reduction of noise and improvement of performance for antennasand the wireless communication systems as such, is enabled by embeddingchips in the multi-chip assembly, e.g. using embedded die technology.

The multi-chip assembly may comprise a plurality of layers, such a 3layer, 5 layers, such as at least 10 layers, such as up to 15 layers,such as 12 layers, such as between 10 and 15 layers. It is herebypossibly to shield embedded chips with multiple ground layers todecrease electromagnetic radiation, such as the E-field emitted, fromthe embedded chip, including e.g. from an embedded switching NP chip.

It is a further advantage of one or more embodiments of the presentdisclosure that by embedding chips which would otherwise have beenprovided at a surface of the multi-chip assembly, or elsewhere in thehearing device, the one or more microphones may be provided on thesurface of the multi-chip assembly. Thereby, the need for additionalwires for connecting e.g. the one or more microphones to the multi-chipassembly, such as to the signal processor of the multi-chip assembly,may be reduced or eliminated. Likewise, other electrical components,such as the MI chip could also be provided at the surface of themulti-chip assembly, further reducing the need for additional wires.

In some embodiments, one or more decoupling capacitors are embeddedinside the multi-chip assembly to reduce any length of radiation traces.The decoupling capacitors may be connected to the embedded die(s).

In some embodiments, the wireless communication unit, or the wirelesscommunication chip, is configured for wireless communication, includingwireless data communication, including wireless audio communication, andis interconnected with an antenna for emission and reception of anelectromagnetic field or a magnetic field; the wireless communicationchip comprises a transmitter, a receiver, a transmitter-receiver pair,such as a transceiver, a radio unit, etc.; the wireless communicationchip is configured for communication using any protocol as known for aperson skilled in the art.

In some embodiments, the hearing device comprises a magnetic inductionantenna and wherein a first wireless communication chip is a magneticinduction control chip.

In some embodiments, the hearing device is configured to communicateusing magnetic induction, such a near-field magnetic induction. In someembodiments, the magnetic induction control chip is an integratedcircuit implementing magnetic induction transmit and receive functions,such as magnetic induction transmit and receive control functions. Themagnetic induction control chip is interconnected to the magneticinduction antenna e.g. via electrical wires or via electrical conductivetraces on a support substrate. The hearing device comprising themagnetic induction control chip and the magnetic induction antenna isbeing configured to communicate using magnetic induction, such anear-field magnetic induction. The magnetic induction antenna may be amagnetic induction coil. The magnetic induction control chip may beconfigured to control power supply to the magnetic induction antenna.

In some embodiments, the magnetic induction control chip is configuredto apply any modulation schemes including amplitude modulation, phasemodulation, and/or frequency modulation to the data signal to becommunicated via magnetic induction so that data are modulated onto themagnetic field emitted from the magnetic induction antenna. The magneticinduction control chip may comprise circuits, such as low noiseamplifiers (LNA), mixers and filters. The magnetic induction controlchip may also comprise peripheral digital blocks such as frequencydividers, codec blocks, demodulators, etc.

In some embodiments, the magnetic induction antenna is furthermoreconfigured for receiving a magnetic field communicated by anotherelectronic device, such as via a magnetic induction antenna of anotherelectronic device, and providing the received data signal to themagnetic induction control chip. The magnetic induction control chip isconfigured to demodulate the received signal. In some embodiments themagnetic induction control chip is configured as a transceiver. In someembodiments, the magnetic induction control chip is configured toreceive and transmit data at a particular frequency.

The data communicated may include data, audio, voice, settings,information, etc.

The magnetic induction antenna and the magnetic induction control chipmay be configured to operate at a frequency below 100 MHz, such as atbelow 30 MHz, such as below 15 MHz, during use. The magnetic inductionantenna may be configured to operate at a frequency range between 1 MHzand 100 MHz, such as between 1 MHz and 15 MHz, such as between 1 MHz and30 MHz, such as between 5 MHz and 30 MHz, such as between 5 MHz and 15MHz, such as between 10 MHz and 11 MHz, such as between 10.2 MHz and 11MHz. The frequency may further include a range from 2 MHz to 30 MHz,such as from 2 MHz to 10 MHz, such as from 2 MHz to 10 MHz, such as from5 MHz to 10 MHz, such as from 5 MHz to 7 MHz.

However, it is envisaged that the hearing device as herein disclosed isnot limited to operation in such a frequency band, and the hearingdevice may be configured for operation in any frequency band.

In some embodiments, the impedance of the magnetic induction antenna isselected to optimize communication.The magnetic induction antenna may insome examples have an impedance larger than a threshold inductance, suchas an inductance larger than 2 pH, such as an inductance larger than 3pH, such as larger than 3.5 pH, such as about 3.9 pH or an inductance ofup to 5 pH. The inductance may be selected to be between 2 pH and 5 pH,such as between 3 pH and 4 pH.

In some embodiments, the magnetic induction antenna has a longitudinaldirection being parallel to an ear-to-ear axis of a user of the hearingdevice, when the hearing device is provided in the intended operationalposition at the ear of a user, the longitudinal direction may be theaxis along which axis coil windings of the magnetic induction antennaare provided. In one or more embodiments, the magnetic induction antennahas a longitudinal extension in a direction being parallel to, or beingsubstantially parallel to, or being 0/180 degrees+/−35 degrees, to anear-to-ear axis of a user, when the hearing device is worn in itsoperational position during use.

In some embodiments, the hearing device comprises an RF antenna, andwherein a second wireless communication chip is an RF wirelesscommunication chip.

The hearing device may comprise a magnetic induction antenna. Thehearing device may comprise an RF antenna. The hearing device maycomprise both a magnetic induction antenna and an RF antenna.

In some embodiments, the wireless communication chip is interconnectedwith an RF antenna for emission and reception of an electromagneticfield. The wireless communication chip interconnected with an RF antennamay be configured for communicating with another electronic device. Thedata communicated via the wireless communication chip may include data,audio, voice, settings, information, etc.

Typically, the length of the RF antenna is defined in relation to awavelength A of the electromagnetic field to be emitted from and/orreceived by the hearing device when it is positioned at its intendedoperational position at the ear of a user. The hearing device istypically configured to emit and/or receive electromagnetic radiationwithin a specific frequency range or band. In some embodiments, the RFfrequency band is provided so as to include a resonance frequency forthe antenna elements. Typically, the length of the antenna elements areoptimized for use within such specific RF frequency bands, such as in aband about, or extending from, a peak resonant frequency.

For an RF antenna to be resonant, the length of the resonating elementin free air is selected to correspond to an odd multiple of aquarter-wavelength, λ/4, of a wavelength λ of the electromagneticradiation to be emitted from the hearing device.

Typically, the length of the RF antenna is selected to optimize the RFantenna for use at a specific frequency or within a specific frequencyband, such as selected to provide an optimum resonance at a specificfrequency, such as within a desired frequency band. Typically, theantenna is optimized for ISM bands, including cellular and WLAN bands,such as for GSM bands or WLAN bands.

In some embodiments the RF antenna is an electrical antenna. In someembodiments, the RF antenna is a monopole antenna. In some embodiments,the RF antenna is a resonant antenna, such as an RF antenna configuredto emit an electromagnetic field in a wavelength range about a resonancefrequency.

The frequency band may be an RF frequency band comprising a frequencyselected from the following frequencies, such as comprising 433 MHz, 800MHz, 915 MHz, 1800 MHz, 2.4 GHz, 5.8 GHz, etc. Thus, the RF frequencyband may be selected as an ISM band, such as a GSM band or a WLAN bandcomprising any one or more of these frequencies.

The hearing devices as disclosed herein may be configured for operationin an ISM frequency band. Preferably, the RF antenna is configured foroperation at a frequency of at least 400 MHz, such as of at least 800MHz, such as of at least 1 GHz, such as at a frequency between 1.5 GHzand 6 GHz, such as at a frequency between 1.5 GHz and 3 GHz such as at afrequency of 2.4 GHz. The antenna may be optimized for operation at afrequency of between 400 MHz and 6 GHz, such as between 400 MHz and 1GHz, between 800 MHz and 1 GHz, between 800 MHz and 6 GHz, between 800MHz and 3 GHz, etc.

However, it is envisaged that the hearing device as herein disclosed isnot limited to operation in such a frequency band, and the hearingdevice may be configured for operation in any frequency band.

The wireless communication chip may be configured for communicationusing any protocol as known for a person skilled in the art, including,including Bluetooth, including Bluetooth Low Energy, Bluetooth Smart,etc., WLAN standards, manufacture specific protocols, such as tailoredproximity antenna protocols, such as proprietary protocols, such aslow-power wireless communication protocols, such as CSR mesh, etc.

It is an advantage that by one or more embodiments as presented, an RFantenna and a magnetic induction antenna may be provided in the hearingdevice. To have an RF antenna and a magnetic induction antenna providedin the hearing device increases the wireless communication capabilitiesof the hearing device. However, providing both an RF antenna and amagnetic induction antenna within a hearing device, with therestrictions as set out above pertaining to size, noise, EMCregulations, etc. has typically led to an increased size of the hearingdevices to obtain the improved communication capabilities.

Furthermore, in present day communication systems, numerous differentcommunication systems communicate at or about 2.4 GHz, and thus there isalso a significant environmental electromagnetic noise in the frequencyrange at or about 2.4 GHz. It is an advantage that for some applicationsfor which the noise may be acceptable, for example for datacommunication, an RF antenna may be used. For other applications, inwhich a high noise level may impact the transmission significantly, amagnetic induction antenna may be used. For example, the magneticinduction antenna may be used for streaming of audio.

In some embodiments, the RF antenna is configured for data communicationat a first bit rate. In one or more embodiments, the magnetic inductioncoil is configured for data communication at a second bit rate, thesecond bit rate being larger than the first bit rate, such as by afactor 10, such as by a factor 30, a factor 50, a factor 100, etc.

It is an advantage of using magnetic induction that typically lowlatency may be obtained. Especially when streaming audio, it is ofimportance to keep the latency low, to avoid delays noticeable by auser. Typically, a delay of less than 100 ms, such as of less than 50ms, such as of less than 25 ms, such as of less than 10 ms, such as ofless than 5 ms, such as of less than 1 ms, may be obtained by use ofmagnetic induction for communication.

It is a further advantage of using magnetic induction for example forcommunicating between a first hearing device and a second hearing devicein a binaural system that for the low frequencies, i.e. typically below100 MHz, and corresponding long wavelengths, the head is not consideredas a significant obstacle for the electromagnetic radiation emitted bythe second antenna, thus, the reduction of electromagnetic radiation dueto tissue absorption is reduced when the frequency is reduced.

In some embodiments, the magnetic induction antenna interconnected withthe magnetic induction control chip, such as the first wirelesscommunication chip or unit, is configured to communicate with anotherhearing device of a binaural hearing device.

In some embodiments, the RF antenna interconnected with the RF wirelesscommunication chip, such as the second wireless communication chip orunit, is configured to communicate with body external devices, such asaccessory devices.

In some embodiments, the magnetic induction control chip is provided asan embedded chip and the magnetic induction antenna is provided at thesurface of the first layer, the first shielding layer and/or the furthershielding layers providing a shield between the magnetic inductioncontrol chip and the magnetic induction antenna.

By embedding the magnetic induction control chip in the multi-chipassembly and providing a shielding layer in the multi-chip assembly toshield between the magnetic induction control chip and a magneticinduction antenna provided at the surface of the first layer of themulti-chip assembly enables a compact design, with reduced interferencebetween the magnetic induction antenna and the magnetic inductioncontrol chip. It is an advantage of providing a compact design as thiswill further reduce the amount of wires, such as litze wires, in thehearing device which may further reduce electromagnetic interference,and thus may improve the overall EMC properties of the hearing device.

In some embodiments, the hearing device comprises one or moremicrophones configured to receive an audio signal.

In some embodiments, the one or more microphones are provided at thesurface of the first layer, i.e. at the surface of the first layer ofthe multi-chip assembly. This may be an advantage as a very compactdesign can be obtained, however, also restricting the positioning of themulti-chip assembly to ensure that audio can be received by themicrophones.

In some embodiments, the one or more microphones are provided at acarrier board. This may be an advantage as the carrier board with theone or more microphones may be positioned for optimum receipt of audio.In some embodiments, the carrier board may provide a shielding betweenthe multi-chip assembly and the one or more microphones.

The carrier board may be comprised by a flexible board, such as aflexible printed circuit board. In some embodiments, the carrier boardcomprises an electromagnetic shielding layer. The electromagneticshielding layer may be a coated layer, such as a layer coated by aconductive coating, such as copper, such as conductive ink, theelectromagnetic shielding layer may be a metallic layer, such as a sheetmetal layer, etc.

In some embodiments, the carrier board is configured to form anelectromagnetic shield between the multi-chip assembly and the one ormore microphones.

In some embodiments, electronic components mounted on the first layerinclude passive circuit components. In some embodiments, the passivecircuit components are selected from the group consisting of resistors,capacitors, inductors, transducers and diodes.

In some embodiments, through-holes in the plurality of shielding layersare provided along one or more edges of the plurality of shieldinglayers. In some embodiments, through-holes, such as vias, are providedalong one or more edges of the plurality of plurality of layers in themulti-chip assembly. In some embodiment, the through-holes are providedalong edges of the embedded chips.

In some embodiments, the battery is interconnected with the multi-chipassembly. The battery may be any type of battery. The battery may be aflat battery, such as a button shaped battery. The battery may becircular. The battery may be a disk-shaped battery.

In some embodiments, the battery is a rechargeable battery. In someembodiments, the hearing device further comprises a re-chargeablebattery regulator. In some embodiments, the rechargeable batteryregulator is provided as an embedded chip. In some embodiments, a firstand a second re-chargeable batter regulator is provided e.g. to obtain adesired voltage supply, such as a voltage supply being of the sizeintended for the power supply for the multi-chip assembly. In someembodiments, the re-chargeable battery supplies a power of 3.6 Volt,which is regulated to 1.8 Volt for the voltage supply to multi-chipassembly, and possibly further electronic components of the hearingdevice. In some embodiments, a first regulator is used for regulatingthe power from 3.6 Volt to 1.2 Volt, and a second regulator isconfigured for regulating the power from 1.2 Volt to 1.8. Any powerconversion provides noise which influences the overall signal to noiseratio of the hearing device. It is therefore an advantage of being ableto embed one or more of the rechargeable battery regulators in themulti-chip assembly to reduce noise emitted from the rechargeablebattery regulator(s).

In some embodiments, the hearing device is an ITC hearing device type, aCIC hearing device type, an IIC hearing device type, a BTE hearingdevice type, a hearing protection device, or any combination of thetypes.

According to a further aspect, a binaural hearing device system isdisclosed, the binaural hearing device system comprising a first hearingdevice configured to be provided at a first ear (e.g. left ear) of auser and a hearing device configured to the provided at a second ear ofthe user (e.g. right ear) and wherein one or both of the hearing devicesis/are a hearing device as herein disclosed.

It should be noted that although the embedded chips are provided with anelectromagnetic shield, in some embodiments, the magnetic inductioncontrol chip and/or the power management chip is provided at a firstside of the battery, wherein the magnetic induction antenna is providedat a second side of the battery, wherein the first side is differentfrom the second side. In some embodiments, the battery is configured toprovide a, additional, electromagnetic shield between the magneticinduction control chip and the wireless communication chip provided atthe first side of the battery and the magnetic induction antennaprovided at the second side of the battery.

However, it is an advantage of the present disclosure, that the batterydoes not need to provide a shielding function between the magneticinduction control chip and/or the power management circuits. In someembodiments, the magnetic induction control chip and the powermanagement circuit are provided at a first side of the battery, whereinthe magnetic induction antenna is provided at the same first side of thebattery.

In some embodiments, a further electromagnetic shield is providedbetween the magnetic induction antenna and the magnetic inductioncontrol chip, for example in the form of an encapsulation of themagnetic induction antenna, or in the form of a shield formed by acarrier, such as a carrier carrying hearing device components, such aselectronic components of the hearing device.

In some embodiments, the battery may be provided closer to a second endof the hearing device than to a first end of the hearing device, and themagnetic induction antenna may be provided between the battery, such asbetween a center axis of the battery, and the second end of the hearingdevice. The wireless communication chip and the magnetic inductioncontrol chip may be provided between the battery, such as between thecenter axis of the battery, and the first end of the hearing device.

The first side of the battery and the second side of the battery may beopposite sides of the battery, either transversely or longitudinally.

It is an advantage of providing a dual mode antenna configuration withsame components, in that the size of the hearing device may be reduced,while at the same time increasing the wireless capability.

In some embodiments, the hearing device is an ITC hearing device type, aCIC hearing device type, a BTE hearing device type, a hearing protectiondevice, or any combination of the types. The hearing device may be abehind-the-ear hearing device. The hearing device may be provided as abehind-the-ear module. The hearing device may be an in-the-ear hearingdevice, such as a completely-in-the-canal hearing device. The hearingdevice may be provided as an in-the-ear module. Alternatively, parts ofthe hearing device may be provided in a behind-the-ear module, whileother parts, such as the receiver, may be provided in an in-the-earmodule. The hearing device may be a receiver-in-the-ear hearing device.

For a behind-the-ear hearing device, the hearing device may, when beingpositioned in the intended operational position behind the ear of auser, have a first side extending along a side of the head of the user,and a second side opposite to the first side. Typically, the first sideand second side are longitudinal sides of the BTE hearing device. A topside interconnects the first side and the second side and is positionedfacing away from the ear of the user. Typically, a bottom side likewiseinterconnects the first side and the second side, the bottom side facingtowards the ear of the user. In some embodiments, the longitudinal axisof the magnetic induction antenna is provided extending from the firstside to the second side of the behind-the-ear hearing device.

In another example, an in-the-ear hearing device has a top side. Thehearing device may, when being positioned in the intended operationalposition in the ear of a user, have a shell extending into the earcanal, and the top side being the side of the in-the-ear hearing devicefacing away form the ear canal of the user. Typically, the top side willbe parallel to the faceplate of an in-the-ear hearing device. Typically,a bottom side of the in-the-ear hearing device will be facing towardsthe ear canal of the user. In some embodiments, the longitudinal axis ofthe magnetic induction antenna is provided extending from the top sideto the bottom side of the in-the-ear hearing device.

The signal processing chip is configured for providing a processed audiosignal. The term sound and/or the term acoustic output may be understoodto be an audio signal. Thus, the microphone may be configured to receivesound or an audio signal. An output transducer or speaker/receiver maybe configured to provide or transmit an acoustic output or a processedaudio signal, such as the processed audio signal provided by the signalprocessing chip. The acoustic output or processed audio signal may beprovided or transmitted to an ear of the user wearing the hearing deviceduring use.

It will be appreciated that the speaker of a hearing device is alsoknown in the art as a “receiver”. The term speaker is used herein toavoid confusion with other hearing device components.

In the present disclosure, the term “chip” is used for an integratedcircuit. Typically, the chip, and thus the integrated circuit, isimplemented in a semiconductor substrate, such as silicon. The chip maybe referred to as an integrated circuit, an IC, or a microchip.Typically, a chip, such as the electronic circuits needed to implement aspecific functionality, such as a control function, a transceiverfunction, etc. It is envisaged that in some embodiments, electroniccircuits provided at different chips may be connected to provide aspecific functionality. The use of the term “chip” for integratedcircuits does not limit the term to be a single chip or die, should twochips or dies provide advantageously to provide a specific function.

The chip may implement a function. For example, a signal processing chipmay implement a signal processing unit. Likewise, a wirelesscommunication chip may implement a wireless communication unit; a powermanagement chip may implement power management circuits including powerregulators; etc. Electronic components of the hearing device may beimplemented in a chip.

The present disclosure relates to different aspects including thehearing device described above and in the following, and correspondinghearing devices, binaural hearing devices, hearing devices, hearingdevices, systems, methods, devices, uses and/or product means, eachyielding one or more of the benefits and advantages described inconnection with the first mentioned aspect, and each having one or moreembodiments corresponding to the embodiments described in connectionwith the first mentioned aspect and/or disclosed in the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages will become readily apparentto those skilled in the art by the following detailed description ofexemplary embodiments thereof with reference to the attached drawings,in which:

FIGS. 1a and 1b schematically illustrates an example of components inhearing device,

FIGS. 2a and 2b schematically illustrates the positioning of componentsin the hearing device,

FIG. 3 schematically illustrates an exemplary multi-chip assembly,

FIG. 4 schematically illustrates exemplary positioning of through-holes,

FIG. 5 schematically illustrates a further exemplary multi-chipassembly,

FIG. 6 schematically illustrates a still further exemplary hearingdevice.

DETAILED DESCRIPTION

Various embodiments are described hereinafter with reference to thefigures. Like reference numerals refer to like elements throughout. Likeelements will, thus, not be described in detail with respect to thedescription of each figure. It should also be noted that the figures areonly intended to facilitate the description of the embodiments. They arenot intended as an exhaustive description of the claimed invention or asa limitation on the scope of the claimed invention. In addition, anillustrated embodiment needs not have all the aspects or advantagesshown. An aspect or an advantage described in conjunction with aparticular embodiment is not necessarily limited to that embodiment andcan be practiced in any other embodiments even if not so illustrated, orif not so explicitly described.

Throughout, the same reference numerals are used for identical orcorresponding parts.

As used herein, the term “antenna” refers to a device which convertselectric power into an electromagnetic field or which converts electricpower into a magnetic field. An electric antenna may comprise anelectrically conductive material connected to e.g. a wirelesscommunications chip, such as a radio chip, a receiver, a transmitter ora transceiver. A magnetic antenna may comprise a magnetic induction coilconnected to e.g. a wireless communications chip, such as a radio chip,a receiver, a transmitter or a transceiver.

The claimed invention may be embodied in different forms and should notbe construed as limited to the embodiments set forth herein.

A block-diagram of an embodiment of a hearing device 100 is shown inFIG. 1 a. The hearing device 100 comprises a first transducer, i.e.microphone 102, to generate one or more microphone output signals basedon a received an audio signal. The one or more microphone output signalsare provided to a signal processor 104 for processing the one or moremicrophone output signals. A receiver or speaker 106 is connected to anoutput of the signal processor 104 for converting the output of thesignal processor into a signal modified to compensate for a user'shearing impairment, and provides the modified signal to the speaker 106.

The hearing device signal processor 104 may comprise elements such as anamplifier, a compressor and/or a noise reduction system etc. The signalprocessor 104 may be implemented in a signal processing chip 104′. Thehearing device may further have a filter function, such as compensationfilter for optimizing the output signal.

The hearing device further comprises a wireless communication unit 114interconnected with magnetic induction antenna 116 such as a magneticinduction coil. The wireless communication unit 114 and the magneticinduction antenna 116 may be configured for wireless data communicationusing emission and reception of magnetic field. The wirelesscommunication unit may be implemented as a wireless communication chip114′, such as a magnetic induction control chip 114′. The hearing device100 further comprises a power source 112, such as a battery or arechargeable battery. Furthermore, a power management unit 110 isprovided for controlling the power provided from the battery 112 to thesignal processor 104, the receiver, the one or more microphones, thewireless communication unit (RF) 108, and the wireless communicationunit (MI) 114. The magnetic induction antenna is configured forcommunication with another electronic device, in some embodimentsconfigured for communication with another hearing device, such asanother hearing device located at another ear, typically in a binauralhearing device system.

The hearing device may furthermore have a wireless communication unit108, such as a wireless communication circuit, for wireless datacommunication interconnected with an RF antenna 118 for emission andreception of an electromagnetic field. The wireless communication unitmay be implemented as a wireless communication chip 108′. The wirelesscommunication unit 108, including a radio or a transceiver, connect tothe hearing device signal processor 104 and the RF antenna 118, forcommunicating with one or more external devices, such as one or moreexternal electronic devices, including at least one smart phone, atleast one tablet, at least one hearing accessory device, including atleast one spouse microphone, remote control, audio testing device, etc.,or, in some embodiments, with another hearing device, such as anotherhearing device located at another ear, typically in a binaural hearingdevice system.

The signal processor 104, the wireless communication unit (RF) 108, thewireless communication unit (MI) 114 and the power management unit 110may be implemented as signal processing chip 104′, wirelesscommunication chip (RF) 108′, wireless communication chip (MI) 114′ andpower management chip 110′, respectively.

In FIG. 1 b, a hearing device corresponding to the hearing device asshown in FIG. 1a is seen, except that in FIG. 1 b, only one wirelesscommunication unit 114 is present being interconnected with the magneticinduction antenna 116, the signal processor 104 and the power managementunit 110.

Likewise, even though not shown, also a hearing device having only onewireless communication unit 108 being interconnected with an RF antennafor reception and emission of an electromagnetic field is envisaged.

FIGS. 2a and 2b schematically illustrates an embodiment of a hearingdevice, the hearing device comprising a first microphone 204 a, a secondmicrophone 204 b, a battery 112 with battery contacts 218, a magneticinduction antenna 116 and a multi-chip assembly 206.

The hearing device in FIGS. 2a and FIG. 2b comprises a carrier board 208and a multi-chip assembly 206 being positioned at the carrier board 208.The multi-chip assembly 206 comprises a plurality of layers including afirst layer 222 having a surface 224. The surface is configured formounting of electronic components, and may be configured for SMTmounting of components. Electronic components 210 are mounted onto thesurface 224 of the first layer 222. Also, signal processing chip 104′ ismounted onto the surface 224 of the first layer 222. A spacer layer 226is provided between the first layer 222 and a ground layer 212, of theplurality of layers. The spacer layer 226 may be configured toaccommodate at least one of the plurality of integrated circuit chips asan embedded chip 216. As is seen, the ground layer 212 is provided belowthe first layer 222, and the spacer layer 226. The multi-chip assemblyfurther comprises a first shielding layer 214, the first shielding layer214 being provided between the spacer layer 226 and the first layer 222.

In FIG. 2a , the magnetic induction antenna 116 is provided at thecarrier board 208 a distance from the multi-chip assembly 206. It isseen that the multi-chip assembly and the magnetic induction antenna isprovided at a same side of the battery, such as at the same side of acenter axis 220 of the battery. The battery contact 218 connects to thecarrier board 208 to supply power to at least the multi-chip assemblyprovided at the carrier board 208. It is envisaged that also otherconnections to the battery may be made, and for example, the batterycontacts may connect directly to the multi-chip assembly 206.

In FIG. 2b , the magnetic induction antenna 116 is provided at themulti-chip assembly 206. The magnetic induction antenna 116 is providedat the surface 224 of the first layer 222. The magnetic inductioncontrol chip 114′ is provided as an embedded chip and accommodated bythe spacer layer. The shielding layer 214 provides shielding between themagnetic induction antenna and the magnetic induction control chip 114′.The first shielding layer 214 dampens any unwanted electromagneticradiation, such as noise, stemming from the magnetic induction controlchip 114′. In some embodiments, the first shielding layer 214 providessufficient shielding and/or damping. In some embodiments, a secondshielding layer (not shown in FIG. 2b ) may be provided between thefirst layer and the spacer layer.

In FIG. 3, the multi-chip assembly 206 is shown in more detail. Themulti-chip assembly 206 comprises a plurality of layers including afirst layer 302 having a surface 303. The surface 303 is configured formounting of electronic components, and may be configured for SMTmounting of electronic components. A spacer layer 306 is providedbetween the first layer 302 and a ground layer 312, of the plurality oflayers. The spacer layer 306 may be configured to accommodate at leastone of the plurality of integrated circuit chips as an embedded chip316. As is seen, the ground layer 312 is provided below the first layer302 and the spacer layer 306. The multi-chip assembly further comprisesa first shielding layer 304, the first shielding layer 304 beingprovided between the spacer layer 306 and the first layer 302.Typically, one or more spacer elements 308 are provided to create spacefor the embedded chip 316. The ground layer 312 may form a ground plane,such as a ground potential for the multi-chip assembly.

In some embodiments, the spacer layer 306 provides an opening 314configured to accommodate at least one of the plurality of embeddedchips 316. The spacer layer 306 comprises one or more spacer elements308. The opening 314, such as the height and width of the opening 314,may be defined by the one or more spacer elements 308. In someembodiments the opening is provided in between the spacer elements,inside a ring of spacer element(s), the ring having any shape, circular,rectangular, irregular, etc. The spacer elements may be mechanicalspacer elements providing a mechanical spacer layer. The thickness ofthe spacer layer may be selected to correspond to the thickness of thecomponents, chips, to be embedded.

In FIG. 3, the spacer layer is provided between a second layer 310 and athird layer 311 of the plurality of layers.

The first layer 302, the second layer 310 and the third layer 311 may belayers of a printed circuit board, such as of a flexible printed circuitboard. The layers may comprise electrically conductive paths serving asinterconnections between electronic components of multi-chip assembly.

Typically, the ground layer 312 is electrically insulated from at leastthe first layer by means of an insulating layer 317, and whereinconnections to the ground layer 312 from are provided via through-holesin the first layer 302, the spacer layer 306 and the insulating layer317, and also via the second layer 310 and the third layer 311.

In some embodiments, the second layer 310 is the first shielding layer304. In some embodiments, the third layer 311 is the insulating layer317 In some embodiments, the second layer 310 is the ground layer 312.In such an embodiment, the spacer layer provides insulation between theground layer and the first layer. A further layer 318 may be added belowthe ground layer 312. The further layer 318 may be a bottom layer forthe multi-chip assembly. The further layer 318 may be an insulatinglayer. In some embodiments the further layer 318 has a surface 320configured for surface mounting of electronic components to provide adouble-sided printed circuit board allowing for SMT mounting ofelectronic components on both sides of the PCB.

In some embodiments, more than one embedded chip 316, 322 may beprovided in the spacer layer.

It is envisaged that a plurality of shielding layers may be providedabove and/or below the embedded chip, the plurality of shielding layers,including the first shielding layer, reduces electromagnetic emissionfrom the at least one embedded chip. In some embodiments, the groundlayer 312 is a shielding layer, thus the one or more shielding layersmay additionally comprise the ground layer 312. The first shielding 304layer being different from the ground layer 312.

FIG. 4 shows schematically the through-holes 402 a, 402 b, . . . beingprovided around embedded chips 316, 322. The footprint 316′, 322′ ofembedded chips 316, 322 is illustrated on third layer 311. In FIG. 4,the through-holes in the third layer are provided around the embeddedchips. It is envisaged, that for the through-holes provided in the oneor more shielding layer, 304, 312, it is an advantage to provide thethrough-holes along one or more edges of the plurality of shieldinglayers 304, 312 to provided an optimum shielding of the components. Insome embodiments, sufficient shielding may be obtained by providing thethrough-holes along edges of the components 316, 322 to be shielded.

In FIG. 5, a schematic illustration of an exemplary multi-chip assemblyis provided. In FIG. 5, the embedded chip 114′ is the wirelesscommunication chip (MI) 114′. The wireless communication chip (MI) 114′is provided in spacer layer 306 in the opening 314 provided by the oneor more spacer elements 308. The spacer layer 306 is provided betweensecond layer 310 and third layer 311. A shielding layer 304 is providedbetween the second layer 310 and the first layer 302. The magneticinduction antenna 116, in the form of a magnetic induction coil 116, isprovided at the surface 303 of the first layer 302.

It is an advantage of being able to provide the wireless communicationunit (MI) 114, such as the magnetic induction control chip 114′ and themagnetic induction coil 116 in the same multi-chip assembly, in that thespace required for the elements in the hearing device is reduced, andthe length of any interconnecting wires between the wirelesscommunication chip (MI) 114′ and the magnetic induction coil 116 isreduced. By providing the shielding layer 304 below the first layer sothat the shielding layer is provided between the wireless communicationchip (MI) 114′ and the magnetic induction coil 116 reduces noise or anyother unwanted electromagnetic interference from the wirelesscommunication chip (MI) 114′ so that any influence from such noise orinterference is reduced at the magnetic induction coil and thus theinfluence on the magnetic field generated at the magnetic induction coilis reduced.

It is envisaged that also other chips may be embedded, including e.g.the power management chip.

In FIG. 6, a schematic illustration of another exemplary multi-chipassembly 206 is provided. In FIG. 6, a first embedded chip 321 and asecond embedded chip 322 are provided in the multi-chip assembly 206. Asecondary shield, such as secondary shielding layer 304′, is providedbetween the first embedded chip 321 and the second embedded chip 322.The multi-chip assembly comprises a plurality of layers including thefirst layer 302, the first layer being a top layer of the multi-chipassembly; the first layer having a surface 303, the surface 303 beingconfigured for mounting of electronic components, and may be configuredfor SMT mounting of electronic components.

The first embedded chip 321 is provided in spacer layer 306, such as inthe opening 314 provided by the one or more spacer elements 308. Thespacer layer 306 is provided between second layer 310 and third layer311. A shielding layer 304 is provided between the second layer 310 andthe first layer 302.

The second embedded chip 322 is provided in secondary spacer layer 306′,such as in the secondary opening 314′ provided by one or more secondaryspacer elements 308′. The secondary spacer layer 306′ is providedbetween further layers 310′ and 311′. A secondary shielding layer 304′is provided between the further layer 310′ and the third layer 311. Thesecondary shielding layer thereby provides a shield between the firstembedded chip 321 and the second embedded chip 322.

The first embedded chip and the second embedded chip may any of thepower management chip 110′, the wireless communication chip (RF) 108′,the wireless communication chip (MI) 114′, the signal processing chip104′, etc.

The magnetic induction antenna 116, in the form of a magnetic inductioncoil 116, may be provided at the surface 303 of the first layer 302.

It is envisaged that the secondary shield may be provided as illustratedin FIG. 6 as a shielding layer between the first embedded chip and thesecond embedded chip. In some embodiments, the first embedded chip andthe second embedded chip may be provided in the same spacer layer. Thesecondary shield may be provided as part of the spacer layer. In someembodiments, the spacer elements may additionally comprise shieldingelements to provide shielding between the first embedded chip and thesecond embedded chip.

Exemplary hearing devices are set out in the following embodiments:

-   1. A hearing device comprising-   a multi-chip assembly including a plurality of integrated circuit    chips, the plurality of integrated circuit chips including at least    one of a wireless communication chip, a power management chip, and a    signal processing chip,-   a battery for supplying power,-   the multi-chip assembly comprising:-   a plurality of layers including a first layer having a surface,-   a spacer layer being configured to accommodating at least one of the    plurality of integrated circuit chips as an embedded chip,-   a ground layer being provided below the first layer and the spacer    layer,-   wherein the multi-chip assembly further comprises at least one    shielding layer,-   including a first shielding layer, the first shielding layer being    provided between the spacer layer and the first layer.-   2. A hearing device according to embodiment 1, wherein the spacer    layer is provided between a second layer and a third layer of the    plurality of layers, wherein the ground layer is electrically    insulated from at least the first layer by means of an insulating    layer, and wherein a connection to the ground layer is provided via    through-holes in the first layer, the spacer layer and the    insulating layer.-   3. A hearing device according to embodiment 2, wherein the second    layer is the shielding layer, and wherein the third layer is the    insulating layer.-   4. A hearing device according to any of the preceding embodiments,    wherein the at least one embedded chip includes the wireless    communication chip and/or the power management chip.-   5. A hearing device according to any of the previous embodiments,    wherein the spacer layer provides an opening configured to    accommodate at least one of the plurality of integrated circuit    chips.-   6. A hearing device according to any of the preceding embodiments,    wherein the plurality of shielding layers are provided above and/or    below the embedded chip, the plurality of shielding layers,    including the first shielding layer, reducing electromagnetic    emission from the at least one embedded chip.-   7. A hearing device according to any of the preceding embodiments,    wherein the multi-chip assembly comprises a first embedded chip and    a second embedded chip, and wherein a shielding is provided between    the first embedded chip and the second embedded chip.-   8. A hearing device according to embodiment 7, wherein the first    embedded chip is the power management chip and the second embedded    chip is the wireless communication chip.-   9. A hearing device according to any of the preceding embodiments,    wherein the hearing device further comprises a magnetic induction    antenna and wherein a first wireless communication chip is a    magnetic induction control chip.-   10. A hearing device according to any of the preceding embodiments,    wherein the hearing device further comprises an RF antenna, and    wherein a second wireless communication chip is an RF wireless    communication chip.-   11. A hearing device according to any of the preceding embodiments,    wherein the multi-chip assembly comprises a multi-layer printed    circuit board, PCB, or a multi-layer flexible printed circuit board,    FPCB.-   12. A hearing device according to any of the preceding embodiments,    wherein through-holes in the plurality of shielding layers are    provided along one or more edges of the plurality of shielding    layers.-   13. A hearing device according to any of embodiments 9-12, wherein    the magnetic induction control chip is provided as an embedded chip    and wherein the magnetic induction antenna is provided at the    surface of the first layer, the first shielding layer and/or the    further shielding layers providing a shield between the magnetic    induction control chip and the magnetic induction antenna.-   14. A hearing device according to any of the preceding embodiments,    wherein the hearing device comprises one or more microphones    configured to receive an audio signal, and wherein the one or more    microphones are provided at the surface of the first layer.-   15. A hearing device according to any of embodiments 1-13, wherein    the hearing device comprises one or more microphones configured to    receive an audio signal, and wherein the one or more microphones are    provided at a carrier board,-   16. A hearing device according to any of the preceding embodiments,    wherein electronic components mounted on the first layer includes    passive circuit components, the passive circuit components being    selected from the group consisting of resistors, capacitors,    inductors, transducers and diodes.-   17. A hearing device according to any of preceding embodiments,    wherein the battery is interconnected with the multi-chip assembly.-   18. A hearing device according to any of embodiments 9-17, wherein    the magnetic induction antenna has a longitudinal direction being    parallel to an ear-to-ear axis of a user of the hearing device, when    the hearing device is provided in the intended operational position    at the ear of a user.-   19. A hearing device according to any of the preceding embodiments,    wherein the battery is a rechargeable battery and wherein the    hearing device further comprises a re-chargeable battery regulator.-   20. A hearing device according to embodiment 19, wherein the    rechargeable battery regulator is provided as an embedded chip.-   21. A binaural hearing device system comprising a first hearing    device configured to be provided at a first ear of a user and a    hearing device configured to the provided at a second ear of the    user, and wherein one or both of the hearing devices is/are a    hearing device according to any of embodiments 1-20.

Furthermore, exemplary hearing devices are set out in the followingembodiments:

-   1. A hearing device comprising-   a multi-chip assembly including one or more integrated circuit    chips, the one or more integrated circuit chips including at least    one of a wireless communication chip, a power management chip, and a    signal processing chip,-   a battery for supplying power,-   the multi-chip assembly comprising:-   a plurality of layers including a first layer having a surface,-   a spacer layer being configured to accommodating at least one of the    one or more integrated circuit chips as an embedded chip,-   a ground layer being provided below the first layer and the spacer    layer,-   wherein the multi-chip assembly further comprises at least one    shielding layer,-   including a first shielding layer, the first shielding layer being    provided between the spacer layer and the first layer.-   2. A hearing device according to embodiment 1, wherein the spacer    layer is provided between a second layer and a third layer of the    plurality of layers, wherein the ground layer is electrically    insulated from at least the first layer by means of an insulating    layer, and wherein a connection to the ground layer is provided via    through-holes in the first layer, the spacer layer and the    insulating layer.-   3. A hearing device according to embodiment 2, wherein the second    layer is the shielding layer, and wherein the third layer is the    insulating layer.-   4. A hearing device according to any of the preceding embodiments,    wherein the at least one embedded chip includes the wireless    communication chip and/or the power management chip.-   5. A hearing device according to any of the previous embodiments,    wherein the spacer layer provides an opening configured to    accommodate at least one of the one or more integrated circuit    chips.-   6. A hearing device according to any of the preceding embodiments,    wherein the plurality of shielding layers are provided above and/or    below the embedded chip, the plurality of shielding layers,    including the first shielding layer, reducing electromagnetic    emission from the at least one embedded chip.-   7. A hearing device according to any of the preceding embodiments,    wherein the multi-chip assembly comprises a first embedded chip and    a second embedded chip, and wherein a shielding is provided between    the first embedded chip and the second embedded chip.-   8. A hearing device according to embodiment 7, wherein the first    embedded chip is the power management chip and the second embedded    chip is the wireless communication chip.-   9. A hearing device according to any of the preceding embodiments,    wherein the hearing device further comprises a magnetic induction    antenna and wherein a first wireless communication chip is a    magnetic induction control chip.-   10. A hearing device according to any of the preceding embodiments,    wherein the hearing device further comprises an RF antenna, and    wherein a second wireless communication chip is an RF wireless    communication chip.-   11. A hearing device according to any of the preceding embodiments,    wherein the multi-chip assembly comprises a multi-layer printed    circuit board, PCB, or a multi-layer flexible printed circuit board,    FPCB.-   12. A hearing device according to any of the preceding embodiments,    wherein through-holes in the plurality of shielding layers are    provided along one or more edges of the plurality of shielding    layers.-   13. A hearing device according to any of embodiments 9-12, wherein    the magnetic induction control chip is provided as an embedded chip    and wherein the magnetic induction antenna is provided at the    surface of the first layer, the first shielding layer and/or the    further shielding layers providing a shield between the magnetic    induction control chip and the magnetic induction antenna.-   14. A hearing device according to any of the preceding embodiments,    wherein the hearing device comprises one or more microphones    configured to receive an audio signal, and wherein the one or more    microphones are provided at the surface of the first layer.-   15. A hearing device according to any of embodiments 1-13, wherein    the hearing device comprises one or more microphones configured to    receive an audio signal, and wherein the one or more microphones are    provided at a carrier board,-   16. A hearing device according to any of the preceding embodiments,    wherein electronic components mounted on the first layer includes    passive circuit components, the passive circuit components being    selected from the group consisting of resistors, capacitors,    inductors, transducers and diodes.-   17. A hearing device according to any of preceding embodiments,    wherein the battery is interconnected with the multi-chip assembly.-   18. A hearing device according to any of embodiments 9-17, wherein    the magnetic induction antenna has a longitudinal direction being    parallel to an ear-to-ear axis of a user of the hearing device, when    the hearing device is provided in the intended operational position    at the ear of a user.-   19. A hearing device according to any of the preceding embodiments,    wherein the battery is a rechargeable battery and wherein the    hearing device further comprises a re-chargeable battery regulator.-   20. A hearing device according to embodiment 19, wherein the    rechargeable battery regulator is provided as an embedded chip.-   21. A binaural hearing device system comprising a first hearing    device configured to be provided at a first ear of a user and a    hearing device configured to the provided at a second ear of the    user, and wherein one or both of the hearing devices is/are a    hearing device according to any of embodiments 1-20.

Although particular features have been shown and described, it will beunderstood that they are not intended to limit the claimed invention,and it will be made obvious to those skilled in the art that variouschanges and modifications may be made without departing from the scopeof the claimed invention. The specification and drawings are,accordingly to be regarded in an illustrative rather than restrictivesense. The claimed invention is intended to cover all alternatives,modifications and equivalents.

REFERENCE SIGNS LIST

100 Hearing Device

102 Microphone

104 Signal Processor

104′ Signal processing chip

106 Speaker

108 Wireless communication unit

108′ Wireless communication chip

110 Power management unit

110′ Power management chip

112 Battery

114 Wireless communication unit (MI)

114′ Wireless communication chip (MI)

116 MI Antenna

118 RF Antenna

204 a, 204 b microphones

206 Multi-chip assembly

208 Carrier board

210 Surface mounted components

212 Ground layer

214 Shielding layer

216 Embedded chip

217 Multi-layered structure

218 Battery contacts

220 Center axis of battery

222 First layer

224 Surface of first layer

226 Spacer layer

302 First layer

303 Surface

304 First shielding layer

306 Spacer layer

306′ Secondary spacer layer

308 Spacer element

308′ Secondary spacer element

310 Second layer

311 Third layer

310′ 311′ Further layers

312 Ground layer

314 Opening

314′ Secondary opening

316 Embedded chip

316′ Footprint of embedded chip

317 Insulating layer

318 Further layer

320 Surface

321 First embedded chip

322 Second embedded chip

1. A hearing device comprising: a multi-chip assembly including aplurality of integrated circuit chips, the plurality of integratedcircuit chips including one or a combination of a wireless communicationchip, a power management chip, and a signal processing chip; wherein themulti-chip assembly comprises: a first layer having a surface, a spacerlayer being configured to accommodate one or more of the plurality ofintegrated circuit chips as one or more embedded chips, and a groundlayer below the first layer and the spacer layer, and a first shieldinglayer between the spacer layer and the first layer.
 2. The hearingdevice according to claim 1, further comprising an insulating layerelectrically insulating the ground layer from the first layer.
 3. Thehearing device according to claim 2, further comprising a connection tothe ground layer implemented as via through-hole(s) in the first layer,the spacer layer, and the insulating layer.
 4. The hearing deviceaccording to claim 1, wherein the multi-chip assembly also comprises asecond layer and a third layer, and wherein the spacer layer is betweena second layer and a third layer.
 5. The hearing device according toclaim 1, further comprising an insulating layer, wherein the spacerlayer is between the shielding layer and the insulating layer.
 6. Thehearing device according to claim 1, wherein the one or more embeddedchips comprise the wireless communication chip and/or the powermanagement chip.
 7. The hearing device according to claim 1, wherein thefirst shielding layer is configured to reduce electromagnetic emissionfrom the one or more embedded chips.
 8. The hearing device according toclaim 1, wherein the first shielding layer is above one of the one ormore embedded chips, and wherein the hearing device further comprises asecond shielding layer below the one or more embedded chips.
 9. Thehearing device according to claim 1, wherein the one or more embeddedchips comprise a first embedded chip and a second embedded chip, andwherein the hearing device further comprises a shielding between thefirst embedded chip and the second embedded chip.
 10. The hearing deviceaccording to claim 9, wherein the shielding is in the spacer layer. 11.The hearing device according to claim 9, wherein the first embedded chipis the power management chip and the second embedded chip is thewireless communication chip.
 12. The hearing device according to claim1, further comprising a magnetic induction antenna, wherein the wirelesscommunication chip is a magnetic induction control chip.
 13. The hearingdevice according to claim 12, wherein the magnetic induction antenna hasa longitudinal direction that is parallel to an ear-to-ear axis of auser of the hearing device, when the hearing device is at an intendedoperational position with respect to an ear of the user.
 14. The hearingdevice according to claim 12, wherein the magnetic induction controlchip is one of the one or more embedded chips, and wherein the magneticinduction antenna is at the surface of the first layer; and wherein thefirst shielding layer and/or another shielding layer provides a shieldbetween the magnetic induction control chip and the magnetic inductionantenna.
 15. The hearing device according to claim 1, wherein theplurality of integrated circuit chips also includes an additionalwireless communication chip.
 16. The hearing device according to claim15, wherein the additional wireless communication chip is a RF wirelesscommunication chip, and wherein the hearing device further comprises aRF antenna.
 17. The hearing device according to claim 1, wherein thefirst shielding layer comprises through-holes along one or more edges ofthe first shielding layer.
 18. The hearing device according to claim 1,further comprising one or more microphones configured to receive anaudio signal, wherein the one or more microphones are at the surface ofthe first layer.
 19. The hearing device according to claim 1, furthercomprising electronic component(s) mounted on the first layer.
 20. Thehearing device according to claim 19, wherein the electroniccomponent(s) comprises passive circuit component(s).
 21. The hearingdevice according to claim 19, wherein the electronic component(s)comprises resistor(s), capacitor(s), inductor(s), transducer(s),diode(s), or a combination of the foregoing.
 22. The hearing deviceaccording to claim 1, the plurality of integrated circuit chips alsoincludes a rechargeable battery regulator, and wherein the one or moreembedded chips comprise the rechargeable battery regulator.
 23. Thehearing device according to claim 1, further comprising a battery.